声学 + 骨传导双模拾音，嘈杂/风噪环境下识别率 >95%，适用于 AI 智能眼镜、录音笔和智能项链。
MOD-2026-001
AI Voice Interaction & Bone Conduction Module
Integrated sensor module based on proprietary MEMS chips, ready for plug-and-play deployment.
Product Overview
AI Voice Interaction & Bone Conduction Module 's Core Advantages
Integrated Design
Chip + PCB + firmware in a single compact module
Plug & Play
Standard interfaces for quick system integration
Customizable
Tailored configurations for specific application needs
Detailed Information
Applications
Typical Application Scenarios