Home / Products / Conference & Office Collaboration Audio Module
MOD-CONF-010

Conference & Office Collaboration Audio Module

Integrated sensor module based on proprietary MEMS chips, ready for plug-and-play deployment.

Product Overview

Conference & Office Collaboration Audio Module 's Core Advantages

Integrated Design

Chip + PCB + firmware in a single compact module

Plug & Play

Standard interfaces for quick system integration

Customizable

Tailored configurations for specific application needs

Detailed Information

4-8 麦远场拾音搭配 AI 降噪算法,适用于会议室、办公协作设备和视频终端。

Applications

Typical Application Scenarios

🏢

智能建筑

楼宇自动化、人员定位、HVAC风量监控