HJT1280A

Capacitive MEMS Microphone Die0.6×0.6×0.4 mm (die) · Top-port

MEMS Die0.6 × 0.6 mm100% Wafer TestAu Pads

An ultra-small capacitive MEMS microphone die: 0.6 × 0.6 × 0.4 mm with high static capacitance, low parasitics and a flat 50 Hz–10 kHz response. Au top metallization supports wire bonding; compatible with high-temperature reflow and COB processes — the sensing element for cost-driven in-house analog/digital mic modules. Delivered as wafer, 100% wafer-level tested. Delivered as wafer for module-level packaging.

Die size: 0.6 × 0.6 × 0.4 mm
Static capacitance: 0.45 pF
Bias voltage: 13 V
Frequency response: 50 Hz–10 kHz

Request Samples / Quote Download DatasheetDatasheets and samples via inquiry

Key Features

Six capabilities built for the voice chainWhy HJT1280A

Ultra-small footprint

0.6 × 0.6 × 0.4 mm die for the smallest acoustic cavities and highest board density.

High consistency

MEMS/semiconductor batch fabrication with 100% wafer-level test for consistency and repeatability.

Robust structure

Perforated rigid backplate, anti-stiction bumps, flexible membrane and back cavity — no degradation across wide temperature and humidity.

Process friendly

Au pads for wire bonding; 260 °C ×4 reflow (J-STD-020-C), SMT/SMD compatible.

Volume cost advantage

Batch MEMS/semiconductor fabrication with high die-per-wafer density — the chip sets the floor of your module BOM.

Environmental resilience

-40 ~ +100 °C operating range with long-term sensitivity stability across temperature and humidity; 260 °C ×4 reflow capable.

Datasheet · Typical

Full SpecificationsSpecifications

Electrical

Static capacitance	0.33 / 0.45 / 0.57 pF
Operating bias	13 V
Test conditions	23 ±5 °C / 45 ±15 % RH

Absolute Maximum Ratings

Abs Max

Operating temperature	-40 ~ +100 °C
Storage temperature	-40 ~ +125 °C
Solder & reflow	260 °C, 4 cycles (J-STD-020-C)

Outline & Pads

Outline

Die size	0.6 × 0.6 mm
Thickness	400 µm
Pad size	90 × 90 µm
Scribe line	65 µm
Pad coordinates	V_out (80,520) · V_bias (520,520) · logo (520,80) · NC (80,80) µm

Quality & Compliance

Quality

Test	100% wafer-level test
Environmental	RoHS / REACH / halogen-free
Delivery	Wafer

Typical values at 25 C in the reference circuit; series production follows the official datasheet.

Pin Configuration

Pin DefinitionsPin Definitions

Pin	Name	Description
1	V_out	Voltage output
2	V_bias	Bias
3	LOGO	Foundry logo pad
4	None	NC pad

The sensor area contains fragile membrane/backplate microstructures: never touch mechanically, never wet, and never apply vacuum or high air pressure on either side. Account for condensation and die-bond/PCB stress in housing design — they shift sensitivity.

Applications