Smart Microphone with On-Chip VAD & KWS

JSM2691

Smart Microphone with On-Chip VAD & KWS3.5×2.65×1.0mm · Bottom-port

AI Smart Mic65 dB(A)0.195 mA VAD30 Offline Keywords

JSM2691 integrates a high-sensitivity acoustic sensing element and on-chip AI voice processing in a single device. VAD, keyword spotting and acoustic scene classification run fully offline on-chip; results are reported via I2C or interrupt — no raw audio ever leaves the device. Built for edge voice products constrained by power, size and privacy.

SNR
65 dB(A)
AOP
127 dB SPL
VAD Standby
0.195mA
Sensitivity
-38 dBV
Request Samples / Quote Download DatasheetDatasheets and samples via inquiry

Key Features

Six capabilities built for the voice chainWhy JSM2691

Always-on, uA-class

Continuous VAD at an estimated 0.195 mA device standby current (typical sub-items summed; not battery-side measured).

100% offline inference

VAD, KWS and scene classification run entirely on-chip — no cloud, no network, no audio upload.

Strong acoustics

65 dB(A) SNR and 127 dB SPL AOP give far-field and noisy-scene recognition ample headroom.

Minimal integration

MEMS plus full front-end in one package: the host needs a single I2C and three supplies; an analog mic out is also provided.

Custom wake words

KWS/VAD parameters are configurable over I2C; wake words are customizable with 30 offline keywords on board.

Two-tier engine

A uA-level LP-NPU (BNN) listener wakes the NPU (CNN) recognizer only on hit — balancing power and response.

Datasheet · Typical

Full SpecificationsSpecifications

Acoustic Performance

Acoustic
Sensitivity-39 / -38 / -37 dB
Sensitivity tolerance±1 dB
SNR (20 Hz–20 kHz, A-wt.)65 dB(A)
THD (94 dB SPL @1 kHz)0.05 typ / 0.5 max %
AOP (10% THD @1 kHz)127 dB SPL
PSRR60 dB
DirectivityOmnidirectional

Power & Modes

Power
VAD mode (device standby)≈0.195 mA
KWS mode (device active)≈0.295 mA
On-chip voice core (idle/active)70 / 170 µA
VAD latency10 ms
KWS latency8 ms
Offline keyword capacity30

Electrical & Interface

Electrical
VCC / VDDIO1.6 – 3.6 V (typ 3.3 V)
VDD (mic supply)2.0 V typ
DVDD09On-chip LDO 0.9 V, decoupling only
System clock6.144 / 12.288 MHz
Digital interfaceI2C slave, 0x5A, ≤400 kHz
Event pinsVAD_INT / KWS_INT + RSTN
Analog outMIC_OUT (raw audio available)

Mechanical & Package

Mechanical
Package3.5 × 2.65 × 1.0 mm (±0.1)
Acoustic portØ0.25 ±0.05 mm
Pins13
Operating / storage temp-40~+85 °C / -40~+100 °C
Moisture sensitivityMSL 1

Reliability

Reliability
High-temp storage+105 °C, 1000 h
THB+85 °C / 85 % RH, 1000 h
Thermal shock-40 ↔ +125 °C, 100 cycles
Vibration / shock20 g / 10,000 g, XYZ
Drop / tumble1.5 m / 1.0 m×300, shift <1 dB
ESDHBM ±3 kV · CDM ±250 V · sys ±6/8 kV

Typical values at 25 C in the reference circuit; series production follows the official datasheet.

Ordering & Packaging

Ordering & PackagingHow to Buy

Packaging
Tape & ReelØ330 mm reel · 5,500 pcs/reel · 55,000 per box
Storage
<75 % RHNever vacuum-seal (MSL 1)
Samples
Sample requestsApply via inquiry; typical application circuit and interface notes included

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